Taiwan IC Packaging Corporation (3372.TWO)
- Previous Close
13.80 - Open
13.90 - Bid 13.65 x --
- Ask 13.80 x --
- Day's Range
13.65 - 14.00 - 52 Week Range
10.10 - 26.80 - Volume
143,707 - Avg. Volume
460,673 - Market Cap (intraday)
2.419B - Beta (5Y Monthly) 0.39
- PE Ratio (TTM)
-- - EPS (TTM)
-1.25 - Earnings Date --
- Forward Dividend & Yield --
- Ex-Dividend Date Sep 7, 2023
- 1y Target Est
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Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
www.ticp.com.twRecent News: 3372.TWO
View MorePerformance Overview: 3372.TWO
Trailing total returns as of 5/16/2025, which may include dividends or other distributions. Benchmark is TSEC CAPITALIZATION WEIGHTED ST (^TWII) .
YTD Return
1-Year Return
3-Year Return
5-Year Return
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Statistics: 3372.TWO
View MoreValuation Measures
Market Cap
2.42B
Enterprise Value
2.04B
Trailing P/E
--
Forward P/E
--
PEG Ratio (5yr expected)
--
Price/Sales (ttm)
2.64
Price/Book (mrq)
1.46
Enterprise Value/Revenue
2.23
Enterprise Value/EBITDA
--
Financial Highlights
Profitability and Income Statement
Profit Margin
-23.97%
Return on Assets (ttm)
-7.85%
Return on Equity (ttm)
-12.51%
Revenue (ttm)
915.12M
Net Income Avi to Common (ttm)
-219.39M
Diluted EPS (ttm)
-1.25
Balance Sheet and Cash Flow
Total Cash (mrq)
440.81M
Total Debt/Equity (mrq)
3.96%
Levered Free Cash Flow (ttm)
-91.19M